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EEE1.06 - Bringing Students to the Mountain: A Model for Developing Partnerships to Introduce Students to Cutting-Edge Research 
April 2, 2013   10:15am - 10:30am

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High Resolution Topography Characterization at Die-Scale of Front End CMP Processes
Reducing Density-induced CMP Non-uniformity for Advanced Semiconductor Technology Nodes
Slurry Compositions for Polishing Several New Barrier Films
Characterization of Chemically Modified Thin Films for Optimization of Metal CMP Applications
Analytical Research of Polishing Pad and the Development of Intelligent Pad