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EEE1.02 - Building Computation into the Core of Materials Science and Engineering Education 
April 2, 2013   8:45am - 9:00am

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High Resolution Topography Characterization at Die-Scale of Front End CMP Processes
Characterization of Chemically Modified Thin Films for Optimization of Metal CMP Applications
Analytical Research of Polishing Pad and the Development of Intelligent Pad
Aggressive Diamond Characterization and Wear Analysis during Chemical Mechanical Planarization
Performance of a Novel Slurry Injection System on a Speedfam-IPEC 472 ® Polisher for Inter Layer Dielectric (ILD) Applications