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EEE1.02 - Building Computation into the Core of Materials Science and Engineering Education 
April 2, 2013   8:45am - 9:00am

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High Resolution Topography Characterization at Die-Scale of Front End CMP Processes
Analytical Research of Polishing Pad and the Development of Intelligent Pad
Aggressive Diamond Characterization and Wear Analysis during Chemical Mechanical Planarization
Outstanding Young Investigator Award
Empowering Plasmonics and Metamaterials Technology with New Material Platforms
Mid-Career Researcher Award
Materials for Electronics That Can Stretch, Twist, Fold and Flex