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BBB5.01 - Hierarchical Design of Ultra-Lightweight, Stiff Materials: Coupling between Material and Structural Size Effects 
April 3, 2013   8:30am - 9:00am

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High Resolution Topography Characterization at Die-Scale of Front End CMP Processes
Reducing Density-induced CMP Non-uniformity for Advanced Semiconductor Technology Nodes
Characterization of Chemically Modified Thin Films for Optimization of Metal CMP Applications
Analytical Research of Polishing Pad and the Development of Intelligent Pad
Aggressive Diamond Characterization and Wear Analysis during Chemical Mechanical Planarization