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BB4.06 - Analytical Research of Polishing Pad and the Development of Intelligent Pad 
Date/Time:
April 3, 2013   10:30am - 11:00am
 
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High Resolution Topography Characterization at Die-Scale of Front End CMP Processes
Slurry Compositions for Polishing Several New Barrier Films
Fluorescence Correlation Spectroscopic Investigation of Surface Adsorption of CMP Slurry Additives on Abrasive Particles
Characterization of Chemically Modified Thin Films for Optimization of Metal CMP Applications
Aggressive Diamond Characterization and Wear Analysis during Chemical Mechanical Planarization