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OO11.03 - Delamination of Graphene for High-Performance Plastic Electronics 
April 23, 2014   4:30pm - 4:45pm

Transfer of graphene from metal substrates has typically involved a polymer coating as a support, e.g. polymethyl methacrylate (PMMA), during etching of the metal to limit folding or tearing of graphene; the polymer support is then removed by a chemical or thermal treatment. PMMA residue and metal contaminants on graphene then typically limit its performance by lowering the carrier mobility and increasing the charge impurity density and the Dirac voltage. To overcome this issue, graphene grown on Cu foils was directly transferred to target polyimide (PI) substrates via electrochemical delamination. The Cu substrate was not etched in this process, reducing metal contaminants on the graphene surface. Meanwhile no sacrificial support (PMMA) layer was used so the graphene is free from polymer residue. As shown by SEM and AFM, such ‘direct delamination’ also led to a better contact between graphene and the polyimide substrate; complete graphene films with reduced line disruptions (such as ripples and wrinkles) were obtained. Better electrical performance was achieved in the graphene/PI films, such that they may be suitable for transparent conducting films (TCFs) in ‘plastic electronics’ and potentially for graphene-based electronic devices on PI or other suitable plastic films. We appreciate support from the Office of Naval Research, under grant N00014-11-1-0190; NSF-NASCENT Engineering Research Center (Cooperative Agreement No. EEC-1160494); and the W. M. Keck Foundation.

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Keynote Address
Panel Discussion - Different Approaches to Commercializing Materials Research
Business Challenges to Starting a Materials-Based Company
Fred Kavli Distinguished Lectureship in Nanoscience
Application of In-situ X-ray Absorption, Emission and Powder Diffraction Studies in Nanomaterials Research - From the Design of an In-situ Experiment to Data Analysis