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C1.05 - First Application of All-Hot-Wire Encapsulation Barrier on Organic Light Emitting Diode 
Date/Time:
April 21, 2014   2:45pm - 3:00pm
 
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Flexible organic electronic devices (‘plastic electronics’), such as organic light emitting diodes (OLEDs) and organic solar cells, are very sensitive to oxygen and water vapor, which can quickly degrade these devices. An encapsulation barrier is required, preferably producible by thin film deposition directly onto the sensitive devices, with a water vapor permeation rate (WVTR) of < 1 x 10-5 g/m2.day. For devices made on flexible plastic substrates, the barrier should seal the devices all around. We developed a new organic/inorganic multilayer stack deposited with a single CVD technique. By combining Hot Wire Chemical Vapor Deposition (HWCVD) of silicon nitride (SiNx) with initiated Chemical Vapor Deposition (iCVD) of poly(glycidyl methacrylate) (PGMA), we developed an “all-hot-wire” deposited thin (400 nm thick), optically transparent encapsulation barrier that can be deposited at temperatures below 100 oC. Using the Ca WVTR test, we achieved a WVTR of 5 x 10-6 g/m2.day at 60 oC and 90% relative humidity, for a simple 3-layer stack. An additional advantage of the deposition of SiNx from silane and ammonia onto the PGMA layer is that the internal adhesion of the successive layers is exceptionally strong, because the PGMA still has functional epoxy rings owing to the non-destructive plasma-free iCVD method. By HR-TEM and XPS we observe an intermediate SiOxNy layer between the polymer and the nitride layer. The interlayer turns out to be highly beneficial for interlayer adhesion and this is probably one of the reasons for the excellent barrier properties of our multilayer. We present our first results on all-hot-wire direct thin-film encapsulation on working OLED devices. The all-hot-wire method can easily be extended to a roll-to-roll continuous encapsulation technique.
 


 
 
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