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TIF1.01 - The Future of Materials Science in the Semiconductor Industry 
Date/Time:
April 4, 2013   9:30am - 10:30am
 
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Reducing Density-induced CMP Non-uniformity for Advanced Semiconductor Technology Nodes
Characterization of Chemically Modified Thin Films for Optimization of Metal CMP Applications
Analytical Research of Polishing Pad and the Development of Intelligent Pad
Aggressive Diamond Characterization and Wear Analysis during Chemical Mechanical Planarization
Performance of a Novel Slurry Injection System on a Speedfam-IPEC 472 ® Polisher for Inter Layer Dielectric (ILD) Applications